Customization: | Available |
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Certification: | CE |
Cutting Method: | Laser Cutting |
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Model | G6070 |
Working Area | 600*700mm x2, Dual Platform |
Platform | Dual Marble Platform, Optional Single Platform |
Cutting Laser Source | Infrared Picosecond Laser, Wavelength 1064nm |
-Cooling | Water Cooling |
-Laser Power Power | 50W (Optional 30W 60W 80W) |
Splitting Laser Source | Co2 Laser, Wavelength 10.6µm |
-Cooling | Water Cooling |
-Laser Power Power | 150W (Optional 250W 350W) |
Drive Motor | XY Linear Motor + Optical Grating Scale |
Linear Speed | 0-1000mm/s |
Cutting Speed | 0-500mm/s |
Acceleration | 1G |
Positioning Accuracy | ±2um |
Re-positioning Accuracy | ±1.5um |
Minimal Chipping | 5μm |
Power Consumption | 8KW |
Voltage | AC220V 50HZ |
Machine Dimension | 2100x2100x1960mm |
Weight | 3500kg |